Knometa took ownership of IC Insights' Global Wafer Capacity report in late 2021. As an IC Insights executive, Knometa's Trevor Yancey created this report in 2007 and has been the report's lead analyst and project manager every year since. Mr. Yancey has authored the report as an independent consultant since 2015.
Global Wafer Capacity report provides a detailed breakdown and analysis of the IC industry's wafer fab capacity as it stood in 2021 and then forecasts capacity for each year through 2026.
Accompanying the main report are three addendums: supplemental slides that summarize trends, business profiles of the top 10 300mm capacity leaders, and a spreadsheet of details for all fabs covered in the report.
Report and database covering more than 400 chip fabs.
Detailed classification and analysis of wafer capacity in 2021 along with annual forecasts through 2026.
Data compiled, summarized, and extended into the future using both bottom-up and top-down research methodologies.
Forecast data supported by IC Insights' economic outlook and unit shipment expectations.
300mm, 200mm, ≤150mm
Americas, Europe, Japan, Korea, Taiwan, China, ROW
Analog, DRAM, NAND, ASIC/SOC, MPU/MCU, Image Sensor, Foundry
Leading Edge, Lagging Edge, Mature, Large Feature
CMOS, BiCMOS/BCD, Bipolar, III-V
Company • Fab Name & Location • Date Opened • Wafer Size • Current & Planned Capacity • Process Technology • Products
Knometa Research contributes to semiconductor technology and market reports published by its partners TechSearch International and IC Insights.