Knometa took ownership of IC Insights' Global Wafer Capacity report in late 2021. As an IC Insights executive, Knometa's Trevor Yancey created this report in 2007 and has been the report's lead analyst and project manager every year since. Mr. Yancey has authored the report as an independent consultant since 2015.
Global Wafer Capacity report provides a detailed breakdown and analysis of the IC industry's wafer fab capacity as it stood near the end of 2023 and then forecasts capacity for each year through 2028.
Accompanying the main report are three addendums: supplemental slides that summarize trends, a spreadsheet of details for all fabs covered in the report, and a set of workbooks with spreadsheets of capacity data for charts.
Report and database covering more than 400 chip fabs.
Categorization and analysis of wafer capacity as it existed near end of 2023 along with annual forecasts through 2028.
Data compiled, summarized, and extended into the future using both bottom-up (supply-side) and top-down (demand-side) research and analysis methodologies.
Wafer Size
300mm, 200mm, ≤150mm
Geographic Region/Country
Americas, Europe, Japan, Korea, Taiwan, China, ROW
Product Type
Analog, DRAM, NAND, ASIC/SOC, MPU/MCU, Image Sensor, Foundry
Process Generation
Leading Edge, Lagging Edge, Mature, Large Feature
Process Type
CMOS, BiCMOS/BCD, Bipolar, III-V
Company • Fab Name & Location • Date Opened • Wafer Size • Current & Planned Capacity • Process Technology • Products
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Knometa Research contributes to semiconductor technology and market reports published by TechSearch International, Inc.
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