Teardown Service
A product teardown is the act of deconstructing a product to identify and understand its component parts and functionality. In partnership with TechSearch International, a leading provider of advanced semiconductor packaging analysis, Knometa performs teardowns of smartphones and other devices to gain insights into the latest assembly and packaging technologies. Teardown steps extend all the way to the die level, providing important information about supplier design wins, material choices, assembly techniques, package and die quantities, and system architecture characteristics.
Detailed reports with high-quality images are sold by TechSearch International, Inc.
Teardown Steps
- Completely disassemble system
- Examine thermal management design and materials
- Remove all chips from boards and circuits
- Identify chip manufacturers, part numbers, and functionality
- Determine package types, contact counts, and precise dimensions
- X-ray inspection followed by decapsulation of encapsulated packages
- Analyze die characteristics, including manufacturer, device function, markings, metrics, and interconnects
Report Features
- Database summaries of package counts by package type, device type, package area, and supplier location
- High-quality, high-resolution images of system components, chip packages, die, and cross sections
- High-quality x-ray images taken on equipment provided courtesy of Creative Electron, Inc.
- Metrics for packages, including length, width, seated height, thickness, contact count, and minimum pitch
- Metrics for die, including length, width, interconnect type, bond count, and minimum pitch
Recent Teardowns
- Apple MacBook Pro (14-in, M5 Pro)
- Apple iPhone 17 Pro Max
- Nintendo Switch 2
- Samsung Galaxy S25 Ultra
- Samsung Galaxy Watch7 with LTE
- Honor Watch 4 with LTE
- Xiaomi 14
- DJI Neo drone & accessories
- Apple iPhone Air
- Apple Watch Series 10
- Apple AirPods 4
- SpaceX Starlink Mini
- Samsung Galaxy A35 5G
- Google Pixel 8 Pro