Launched in 2007, the Global Wafer Capacity report is a leading resource for understanding the industry's fab capacity.
Knometa disassembles the latest smartphones and other devices to gain insights into the latest chip technologies.
Knometa Research is led by former IC Insights co-founder and vice president, Trevor Yancey, a seasoned industry analyst who since 1988 has tracked semiconductor technology advancements and market dynamics.
In his long career Mr. Yancey has pursued an understanding of advancements in semiconductor front-end and back-end manufacturing technologies, computing and communications functionalities, and software capabilities.
Since the late 1980s Mr. Yancey has been studying supply and demand market dynamics for high-tech industries, successfully forecasting growth potential in wide ranging market segments, and finding useful ways to show market trends.
Knometa has first-hand knowledge of new chip technologies via teardowns of the latest smartphones and other devices. Chips are examined from the package all the way down to the die level. Detailed reports are sold by Knometa-partner TechSearch International.
Global Wafer Capacity was thoroughly updated with latest wafer fab specifications and a new five-year forecast. Report released in January 2023.
Deep teardown of the iPhone 14 Pro recently completed by Knometa. A report detailing the findings is sold by partner TechSearch International.