A product teardown is the act of deconstructing a product to identify and understand its component parts and functionality. In partnership with TechSearch International, a leading provider of advanced semiconductor packaging analysis, Knometa performs teardowns of smartphones and other devices to gain insights into the latest assembly and packaging technologies. Teardown steps extend all the way to the die level, providing important information about supplier design wins, material choices, assembly techniques, package and die quantities, and system architecture characteristics.
Detailed reports with high-quality images are sold by TechSearch International, Inc.