Global Wafer Capacity 2022
Detailed chip fab analysis and capacity forecast through 2026

Knometa took ownership of IC Insights' Global Wafer Capacity report in late 2021. As an IC Insights executive, Knometa's Trevor Yancey created this report in 2007 and has been the report's lead analyst and project manager every year since. Mr. Yancey has authored the report as an independent consultant since 2015.

Global Wafer Capacity report provides a detailed breakdown and analysis of the IC industry's wafer fab capacity as it stood in 2021 and then forecasts capacity for each year through 2026.

Accompanying the main report are three addendums: supplemental slides that summarize trends, business profiles of the top 10 300mm capacity leaders, and a spreadsheet of details for all fabs covered in the report.

Use to learn about:

  • Capacity, wafer start & utilization forecasts
  • IC Market, Unit & ASP forecasts
  • Supply versus demand projections
  • Utilization rate influences on pricing
  • Rankings of capacity leaders
  • Capacity forecasts for DRAM, NAND, MPU/MCU, etc.
  • Forecast for leading-edge capacity
  • Business profiles of 300mm wafer capacity leaders
  • Successes and failures of China's ambitions to become a world leader in IC fabrication
  • Detailed specifications for hundreds of semiconductor fabs

Coverage and Methodology

Report and database covering more than 400 chip fabs.

Detailed classification and analysis of wafer capacity in 2021 along with annual forecasts through 2026.

Data compiled, summarized, and extended into the future using both bottom-up and top-down research methodologies.

Forecast data supported by IC Insights' economic outlook and unit shipment expectations.

Data Classifications

Wafer Size
300mm, 200mm, ≤150mm

Geographic Region/Country
Americas, Europe, Japan, Korea, Taiwan, China, ROW

Product Type
Analog, DRAM, NAND, ASIC/SOC, MPU/MCU, Image Sensor, Foundry

Process Generation
Leading Edge, Lagging Edge, Mature, Large Feature

Process Type
CMOS, BiCMOS/BCD, Bipolar, III-V

Fab Details Database
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Company • Fab Name & Location • Date Opened • Wafer Size • Current & Planned Capacity • Process Technology • Products

Report Details
Report Published February 1, 2022

Topics Covered
  • Market Trends
  • Capital Spending Trends and Leaders
  • Government Investment Incentives
  • History and Forecast for Wafer Capacity, Starts & Utilization
  • Top 25 Installed Capacity Leaders
  • Fab Closures and Capacity Disruptions
  • Seismic and Cyberattack Risks to Fab Operations
  • IC Fabs Closed/Repurposed
  • New Fabs Scheduled to Open
  • Existing and Future Capacity by Geography
  • Existing and Future Capacity by Wafer Size
  • Capacity Leaders by Wafer Size
  • 300mm Wafer Fab Count, Trends & Capacity Leaders
  • 200mm Wafer Fab Count and Trends
  • Existing and Future Capacity by Product Type
  • Existing and Future Capacity by Process Technology & Generation
  • Capacity Leaders by Process Generation
  • Addendum I: Supplemental slides
  • Addendum II: Profiles of 300mm Wafer Capacity Leaders
  • Addendum III: Fab Facility Specifications
Table of Contents

MAIN REPORT
Introduction

   Report Origins
   Methodology
   Coverage
   Wafer Size Normalization
Market & Capital Spending Trends
   Market Trends
   Capital Spending Trends
      Samsung
      TSMC
      Intel
      SK Hynix
      Micron
      SMIC
   Government Investment Incentives
Capacity Trends Overview
   Installed Capacity Leaders
   Top 10 IC Wafer Capacity Leaders
      Samsung
      TSMC
      Micron
      SK Hynix
      Kioxia/Western Digital
      Intel
   Fab Closures and Capacity Disruptions
   Earthquakes Present Capacity Risks
      Past Earthquakes
      Recent Earthquakes
   Cyberattack Risks to Fab Operations
   Other Recent Capacity Disruptions
Capacity by Geography
   Capacity by Headquarters Location vs. Fab Location
   Future Capacity by Geography
Capacity by Wafer Size
   Geographical Distributions of Existing Capacity by Wafer Size
   Future Capacity by Wafer Size
   300mm Wafer Fab Capacity Details
   300mm Wafer Capacity Leaders
   300mm “Power” Ranking
   200mm Wafer Fab Capacity Details
Capacity by Product
   Geographical Distributions of Existing Capacity by Product
   Future Capacity by Product
Capacity by Technology
   Capacity by Process Architecture
   Capacity by Process Generation
   Leading Edge Processes
   Lagging Edge Processes
   Mature Processes
   Large Feature Processes
   Geographical Distributions of Existing Capacity by Generation
Conclusions
References

ADDENDUM: Profiles of 300mm Capacity Leaders
Samsung
   General Information
   Brief History
   Business Overview
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened
TSMC
   General Information
   Brief History
   Business Overview
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened
Micron
   General Information
   Brief History
      Acquisitions
   Business Overview
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened
SK Hynix
   General Information
   Brief History
   Business Overview
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened
Kioxia (and partner Western Digital)
   General Information
   Brief Kioxia History
   Brief Western Digital/San Disk History
   Business Overviews
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened
Intel
   General Information
   Brief History
   Business Overview
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened
GlobalFoundries
   General Information
   Brief History
   Business Overview
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened
UMC
   General Information
   Brief History
   Business Overview
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened
Sony
   General Information
   Brief History
   Business Overview
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened
Texas Instruments
   General Information
   Brief History
   Business Overview
   Financial Highlights
   Fab Facility Status
      300mm Fabs Recently Opened/Expanded
      300mm Fabs to Be Opened

Content/Page Count
  • Main Report — 106 pages with 82 tables and figures
  • Supplemental Slides — 42 slides summarizing findings in main report
  • Profiles of 300mm Wafer Capacity Leaders — 42 pages with 26 tables
  • Fab Facility Specifications — 43 page spreadsheet
List of Figures

MAIN REPORT
Manufacturers Included in IC Wafer Capacity Analysis (1 of 3)
Manufacturers Included in IC Wafer Capacity Analysis (2 of 3)
Manufacturers Included in IC Wafer Capacity Analysis (3 of 3)
IC Fab Facilities Covered in Report
Worldwide Semiconductor Sales Growth
IC Market Growth Rates
Forecast for IC Market Growth Rates
Semiconductor Capital Spending Trends
Semiconductor Capital Spending by Product Type
2021 Semiconductor CapEx Leaders
2021 Semiconductor CapEx/Sales Ratio Comparisons
Examples of Government Programs for Chip Fab Investments
Annual Global IC Wafer Capacity History and Forecast
Annual Global IC Wafer Capacity History and Forecast
Volume Changes in Annual Global IC Wafer Capacity
TSMC’s Fab Strategy for Continuous Improvement
Global IC Wafer Capacity Leaders at Dec-2021
Samsung’s Global Manufacturing Operations for Foundry Services
Micron Achieves Bit Supply Growth with Node Transitions
Intel’s Fab Strategy Reinvigorated Under New CEO
Share Perspectives for Capacity Leaders at Dec-2021
Global Semiconductor Wafer Capacity Leaders at Dec-2021
Top 10 IC Wafer Capacity Leaders at Dec-2021
Semiconductor Fab Closures by Wafer Size
Semiconductor Fabs Closed Since 2016
Fabs to be Closed in Near Future
IC Fabs Repurposed for Non-IC Production Since 2016
Seismically Risky* Global IC Wafer Capacity
Seismically Risky Pure-Play IC Foundry Capacity
Global IC Wafer Capacity at Dec-2021 – by Fab Location
Global IC Wafer Capacity at Dec-2021 – by HQ Geography
Global IC Wafer Capacity at Dec-2021 – Fab vs. HQ Location
China-Based Fabs More Cost Competitive Due to Government Support
Some Achievements from China's Efforts to Foster Its Semiconductor Industry
Recent Failed Fab Projects in China
Forecast Installed Monthly IC Wafer Capacity – by Geography
Forecast Installed Monthly IC Wafer Capacity – by Geography (table)
Forecast Installed Monthly IC Wafer Capacity Shares – by Geography
Global IC Wafer Capacity at Dec-2021 – by Wafer Size
Global IC Wafer Unit Volume Capacity at Dec-2021 – by Wafer Size
Geographical IC Wafer Capacity by Wafer Size at Dec-2021
Installed Monthly IC Wafer Capacity for Each Wafer Size at Dec-2021 – by Fab Geography
Installed Monthly IC Wafer Capacity for Each Geography at Dec-2021 – by Wafer Size
Global IC Wafer Capacity Leaders at Dec-2021 – by Wafer Size
Forecast Installed Monthly IC Wafer Capacity Shares – by Wafer Size
Forecast Installed Monthly IC Wafer Capacity – by Wafer Size (table)
Forecast Installed Monthly IC Wafer Capacity – by Wafer Size
Number of Semiconductor Fabs Using 300mm Wafers
300mm Wafer Fabs Opened in 2021
300mm Wafer Fabs Opening in 2022
Samsung’s Pyeongtaek Site
TSMC’s Fab Sites in Tainan
TSMC’s Fab 12 & Fab 20 Site in Hsinchu
Construction of TSMC’s Fab 21 in Arizona Underway
Site of Kioxia and Western Digital JV Fabs in Yokkaichi
Intel’s Ocotillo Site in Chandler, Arizona
Intel’s Site in Leixlip, Ireland
300mm Semiconductor Wafer Capacity Leaders at Dec-2021
Share Perspectives for 300mm Semiconductor Wafer Capacity Leaders at Dec-2021
Comparing 300mm Semiconductor Wafer Capacity Based on Fab and HQ Locations
"Power" Ranking of 300mm Wafer Capacity Leaders at Dec-2021
Number of IC Fabs Using 200mm Wafers
Power Discretes and MEMS Sensors Are Focus of New 200mm Fabs
Global IC Wafer Capacity at Dec-2021 – by Product Type
Devices Included in Product Categories
Global IC Wafer Capacity at Dec-2021 – by Product Type
Die Sizes for Various Types of Semiconductors
Foundry Shares of Total IC Wafer Capacity at Dec-2021
Geographical IC Wafer Capacity by Product Type at Dec-2021
Geographical IC Wafer Capacity by Product Type at Dec-2021 (details)
Installed Monthly IC Wafer Capacity for Each Product Type at Dec-2021 – by Fab Geography
Installed Monthly IC Wafer Capacity for Each Geography at Dec-2021 – by Product Type
Installed Monthly IC Wafer Capacity for Each Product Type at Dec-2021 – by Fab Geography
Installed Monthly IC Wafer Capacity for Each Geography at Dec-2021 – by Product Type
Forecast Installed Monthly IC Wafer Capacity – by Product Type
Forecast Installed Monthly IC Wafer Capacity – by Product Type (table)
Forecast Installed Monthly IC Wafer Capacity Shares – by Product Type
Forecast Installed Monthly IC Wafer Capacity – by Product Type
Forecast Installed Monthly IC Wafer Capacity – by Product Type (table)
Forecast Installed Monthly IC Wafer Capacity Shares – by Product Type
Global IC Wafer Capacity at Dec-2021 – by Architecture
Global IC Wafer Capacity at Dec-2021 – by Generation
Geographical IC Wafer Capacity by Generation at Dec-2021
Installed Monthly IC Wafer Capacity for Each Generation at Dec-2021 – by Fab Geography
Foundry Revenues from Advanced Processes
Installed Monthly IC Wafer Capacity for Each Geography at Dec-2021 – by Generation
Global IC Wafer Capacity Leaders at Dec-2021 – by Generation Group
Forecast Installed Monthly IC Wafer Capacity – by Generation (table)
Forecast Installed Monthly IC Wafer Capacity – by Generation
Forecast Installed Monthly IC Wafer Capacity Shares – by Generation

ADDENDUM: Profiles of 300mm Capacity Leaders
Samsung Financial Highlights
Samsung 300mm Wafer Fabs
TSMC Financial Highlights
TSMC 300mm Wafer Fabs
TSMC/Sony Joint-Venture 300mm Wafer Fab
Micron Financial Highlights
Micron 300mm Wafer Fabs
SK Hynix Financial Highlights
SK Hynix 300mm Wafer Fabs
Kioxia Financial Highlights
Western Digital Financial Highlights
Kioxia/Western Digital 300mm Wafer Fabs
Intel Financial Highlights
Intel 300mm Wafer Fabs
GlobalFoundries Financial Highlights
GlobalFoundries 300mm Wafer Fabs
GlobalFoundries/Onsemi 300mm Wafer Fabs
UMC Financial Highlights
UMC 300mm Wafer Fabs
Sony Financial Highlights
Sony 300mm Wafer Fabs
TSMC/Sony Joint-Venture 300mm Wafer Fab
Texas Instruments Financial Highlights
Texas Instruments 300mm Wafer Fabs

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