Knometa took ownership of IC Insights' Global Wafer Capacity report in late 2021. As an IC Insights executive, Knometa's Trevor Yancey created this report in 2007 and has been the report's lead analyst and project manager every year since. Mr. Yancey has authored the report as an independent consultant since 2015.
Global Wafer Capacity report provides a detailed breakdown and analysis of the IC industry's wafer fab capacity as it stood in 2022 and then forecasts capacity for each year through 2027.
Accompanying the main report are three addendums: supplemental slides that summarize trends, a spreadsheet of details for all fabs covered in the report, and a set of workbooks with spreadsheets of capacity data for charts.
Report and database covering more than 400 chip fabs.
Detailed classification and analysis of wafer capacity in 2022 along with annual forecasts through 2027.
Data compiled, summarized, and extended into the future using both bottom-up and top-down research methodologies.
Forecast data supported by IC Insights' economic outlook and unit shipment expectations.
300mm, 200mm, ≤150mm
Americas, Europe, Japan, Korea, Taiwan, China, ROW
Analog, DRAM, NAND, ASIC/SOC, MPU/MCU, Image Sensor, Foundry
Leading Edge, Lagging Edge, Mature, Large Feature
CMOS, BiCMOS/BCD, Bipolar, III-V
Company • Fab Name & Location • Date Opened • Wafer Size • Current & Planned Capacity • Process Technology • Products
New for 2023 Edition, Greater Detail:
2022 Capacity, 2023 Capacity (Forecast), Process Generation Range
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Knometa Research contributes to semiconductor technology and market reports published by TechSearch International, Inc.