Complete teardown of iPhone 13 Pro finds 176 chip packages
Working on a contract basis for TechSearch International, Knometa Research completed a deep teardown of the iPhone 13 Pro to gain insights into the chip technologies used within. Every one of the 176 packages in the 13 Pro were disassembled, decapsulated, and examined down to the die level.
A detailed report of the findings is sold by TechSearch International.
A detailed report of the findings is sold by TechSearch International.