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At the end of 2021, there were 153 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.

The 300mm wafer fab count increased by 14 in 2021, the most in one year since the same number opened in 2005. There are 10 fabs scheduled to open in 2022, followed by another 13 in 2023 and 10 in 2024. This puts the industry on pace to have more than 200 300mm fab lines in operation by 2026.

Intel announced plans to acquire Tower Semiconductor for $5.4 billion as part of efforts to become a major provider of foundry services and capacity. Intel describes the deal as highly complementary, bringing together its leading-edge nodes and scale manufacturing with Tower’s specialty technologies and customer-first approach to delivering technology and manufacturing capabilities.

Based on data compiled for Knometa’s new Global Wafer Capacity 2022 report, Tower was industry’s ninth largest foundry at the end of 2021 in terms of installed capacity. Tower has four wholly owned and three majority owned fab sites around the world. Tower also has a partnership with STMicroelectronics to share the cleanroom space in a new 300mm fab ST is opening later this year in Italy.

Tower's wholly owned fabs

The new 2022 edition of Global Wafer Capacity shows that China’s share of the world’s capacity for fabricating IC wafers continued to grow in 2021. The country ended the year having 16% of global capacity, based on normalized installed monthly capacity amounts.

China’s share of capacity has increased one percentage point in each of the last two years and a total of seven points since 2011, when the country accounted for just 9% of all IC wafer capacity.

As part of IC Insights’ recent efforts to focus on The McClean Report, business pertaining to the Global Wafer Capacity report has been transferred to Trevor Yancey, a co-founder of IC Insights currently working independently as Knometa Research.