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With Tower acquisition, Intel will take over industry’s ninth largest foundry
Intel announced plans to acquire Tower Semiconductor for $5.4 billion as part of efforts to become a major provider of foundry services and capacity. Intel describes the deal as highly complementary, bringing together its leading-edge nodes and scale manufacturing with Tower’s specialty technologies and customer-first approach to delivering technology and manufacturing capabilities.

Based on data compiled for Knometa’s new Global Wafer Capacity 2022 report, Tower was industry’s ninth largest foundry at the end of 2021 in terms of installed capacity. Tower has four wholly owned and three majority owned fab sites around the world. Tower also has a partnership with STMicroelectronics to share the cleanroom space in a new 300mm fab ST is opening later this year in Italy.

Tower's wholly owned fabs
Fab Name and Location Wafer Capacity
Fab 1 – Migdal Haemek, Israel 150mm 20,000 wpm
Fab 2 – Migdal Haemek, Israel 200mm 43,000 wpm
Fab 3 – Newport Beach, California, USA 200mm 24,000 wpm
Fab 9 – San Antonio, Texas, USA 200mm 30,000 wpm
China's share of global wafer capacity continues to climb
knometa research, global semiconductor analysis, Global Wafer Capacity by Fab Location
The new 2022 edition of Global Wafer Capacity shows that China’s share of the world’s capacity for fabricating IC wafers continued to grow in 2021. The country ended the year having 16% of global capacity, based on normalized installed monthly capacity amounts.

China’s share of capacity has increased one percentage point in each of the last two years and a total of seven points since 2011, when the country accounted for just 9% of all IC wafer capacity.
Ownership of Global Wafer Capacity report transferred to former IC Insights executive, Trevor Yancey
knometa research, global semiconductor analysis, Global Wafer Capacity 2022
As part of IC Insights’ recent efforts to focus on The McClean Report, business pertaining to the Global Wafer Capacity report has been transferred to Trevor Yancey, a co-founder of IC Insights currently working independently as Knometa Research.
Complete teardown of iPhone 13 Pro finds 176 chip packages
Working on a contract basis for TechSearch International, Knometa Research completed a deep teardown of the iPhone 13 Pro to gain insights into the chip technologies used within. Every one of the 176 packages in the 13 Pro were disassembled, decapsulated, and examined down to the die level.

A detailed report of the findings is sold by TechSearch International.

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