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Strong Growth in Wafer Capacity for Image Sensors Expected
knometa research, global semiconductor analysis, Number of Semiconductor Fabs Using 300mm Wafers
Global installed capacity for image sensors was one million 200mm-equivalent wafers per month at the end of 2021. According to the new Global Wafer Capacity 2022 report, image sensor capacity is forecast to increase 13% in 2022.

By the end of 2026, installed capacity for image sensors is projected to be 1.8 million 200mm-equiv. wafers per month. That’s an average annual growth rate of 12.5% over the forecast period, making image sensor capacity among the fastest growing segments.
Top Five Leaders Continue Expanding Share of Global IC Fab Capacity
knometa research, global semiconductor analysis, Number of Semiconductor Fabs Using 300mm Wafers
At the end of 2021, 57% of the industry’s total monthly wafer capacity was owned by the top five companies. One year earlier the share was 56% and back in 2018 it was 53%. A decade ago, the share held by the top five was about 40%. The industry continues to get more top heavy regarding the composition of companies fabricating ICs. This analysis comes from Knometa’s recently released Global Wafer Capacity 2022 report.
Industry's aggressive fab expansion plans do not necessarily mean a capacity glut is looming
knometa research, global semiconductor analysis, Number of Semiconductor Fabs Using 300mm Wafers
With fab construction activity at its highest level in many years, it is not surprising that there has been talk of a market crash coming from too much capacity being added. The new Global Wafer Capacity 2022 report makes the case that, while fab expansion plans are certainly aggressive and could lead to some downward pricing pressure in 2024, a significant market downturn caused by too many fabs sitting with idle capacity is not expected.
Count of semiconductor fabs using 300mm wafers projected to exceed 200 by 2026
knometa research, global semiconductor analysis, Number of Semiconductor Fabs Using 300mm Wafers
At the end of 2021, there were 153 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.

The 300mm wafer fab count increased by 14 in 2021, the most in one year since the same number opened in 2005. There are 10 fabs scheduled to open in 2022, followed by another 13 in 2023 and 10 in 2024. This puts the industry on pace to have more than 200 300mm fab lines in operation by 2026.

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